Practical Considerations For Attaching Surface-mount Components
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چکیده
What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow soldering can be done when (l) there are only surface mount components, or (2) these are present together with through-hole components and the latter will be soldered in a separate (wave soldering) step. The surface-mount components can be located on both the upper and lower sides of the board, when reflow is used. Wave soldering is suitable for through-hole components mounted on top of the board as well as for surface-mount components on the bottom of the board. Both ceramic and polymer-based boards can be accommodated.
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